iso view bottom 12.50 11.20 6.40 3.20 0.80 8.00 4.55 2.96 0.2032 typ. 0.36 2 1 3 iso view top proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. 1 2 substrate: 1.59 0.18mm [0.0625" 0.007"] non clad high temp material. pins:material-brass alloy 360 1/2 hard; finish- 0.25m [10] au over 1.27m [50"] ni (min) solder balls: sn96.5ag3.0cu0.5 3 bottom view front view doc rev date initials description a 9/30/15 sf original ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.0254mm [0.001"], pitches (from true position) 0.0762mm [0.003"], substrate thickness tolerance 10%, all other tolerances 0.127mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: giga-snap bga smt ball on pin land socket for 8mm x12.5mm 84 pin 0.8mm pitch bga primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 9/30/15 material: n/a finish: n/a weight: 0.48 SF-BGA84H-B-61F drawing scale: 5:1 sheet: 1 of 1 eng: s. faiz file: SF-BGA84H-B-61F dwg drawn by: s. faiz
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